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iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Advanced Packaging
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
MEMS
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
silicon-based microdisplay
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
semiconductor industry
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
other
Trancendor® Wafer Vacuum Transfer System
photovoltaic
boron diffusion
Hsihe® Series High Temperature Low Pressure Systems
annealing
Hsihe® Series High Temperature Low Pressure Systems
Tunneling oxidation/polysilicon deposition
Zhu Rong Series ZR5000×2 Tubular PECVD ToxPoly All-in-one System
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
Positive film Al₂O₃/SiNₓ
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
positive film Al₂O₃
Quaife® Series KF20000 Batch ALD System
backing film SiNₓ
Zhu Rong Series ZR5000×1 Tubular PECVD System
barrier package
electron transport layer SnOₓ
Interface layer/encapsulation layer AIOₓ
Industrialization Application Center
Industrialization Application Center
iOptomic Series Atomic Layer Deposition Systems
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Houyi® Series Plate ALD System
iSparol Series Roll-to-Roll ALD System
iTomic® MW Lite Bulk Light Series Atomic Layer Deposition System
Positive film Al₂O₃/SiNₓ
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
The ZR5000×3 tubular PEALD/PECVD integrated coating platform extends the concept of the ZR5000 series, with an all-in-one design that realizes the one-stop completion of silicon nitride positive coating, alumina/back coating, and silicon oxide/polysilicon passivation coating, doubling the production capacity of a single pass and saving the footprint.The ZR5000×3 is equipped with the advanced Manufacturing Execution Management (MES) system and the Automatic Guided Vehicle (AGV) docking function. Docking function. While providing ultra-high capacity, it also minimizes the operating cost of the equipment, providing an ideal and reliable mass production solution for post-PERC high-efficiency cell technology and leading the photovoltaic industry in high-efficiency cell manufacturing.
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Product Features
For PERC, TOPCon, XBC and other high-efficiency cell technology routes
1
Graphite boat design with high chip load capacity
2
Excellent film thickness uniformity
3
Precise preparation of thin films: Al₂O₃, SiO₂, poly-Si(n+), poly-Si(p+), SiNx/ SiC/ SiON, etc
4
Providing PERC/ TOPCon mass production process PEALD/ PECVD route integration technology
5
Reception Hotline：
0510-81975900
Company Addresses：
江苏省无锡市新吴区长江南路27号
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