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We are the domestic equipment company that has successfully applied mass-production High-𝘬 Atomic Layer Deposition (ALD) equipment to the front-end production line of IC manufacturing, realizing the breakthrough of domestic ALD equipment “from 0 to 1”. We have implemented diversified layouts in many semiconductor segments such as logic chips, memory chips, compound semiconductors, new displays, etc., and have obtained repeated batch orders from well-known customers, making us one of the national enterprises that can compete with international giants.
Product Showcase
Application Areas
IC
Integrated circuits are, millions or even billions of electronic components, such as transistors and capacitors, integrated on a single chip for processing and storing information, and are at the heart of modern electronic devices.
Semiconductor Industry
Pan-semiconductors are a class of semiconductor materials, such as gallium nitride and silicon carbide, which are widely used in the manufacture of high-frequency electronic components, LEDs and high-efficiency power supplies with superior electronic characteristics.
Silicon-based Microdisplay
Silicon-based microdisplay technology uses silicon chips to create miniature displays, such as OLEDs, for use in smart glasses, head-mounted devices, and virtual reality systems to provide a high-resolution visual experience.
MEMS
MEMS systems integrate miniature mechanical, electronic and sensor elements for accelerometers, barometers and inertial navigation for precise measurement and control.
Advanced Packaging
Advanced packaging technologies improve the performance and connectivity of semiconductor chips, such as 3D packaging, TSMC CoWoS, etc., facilitating the development of smaller, faster, and more powerful electronic devices.
Collaborative R&D
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Business after-sales consulting
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