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iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Advanced Packaging
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
MEMS
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
silicon-based microdisplay
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
semiconductor industry
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
other
Trancendor® Wafer Vacuum Transfer System
photovoltaic
boron diffusion
Hsihe® Series High Temperature Low Pressure Systems
annealing
Hsihe® Series High Temperature Low Pressure Systems
Tunneling oxidation/polysilicon deposition
Zhu Rong Series ZR5000×2 Tubular PECVD ToxPoly All-in-one System
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
Positive film Al₂O₃/SiNₓ
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
positive film Al₂O₃
Quaife® Series KF20000 Batch ALD System
backing film SiNₓ
Zhu Rong Series ZR5000×1 Tubular PECVD System
barrier package
electron transport layer SnOₓ
Interface layer/encapsulation layer AIOₓ
Industrialization Application Center
Industrialization Application Center
iOptomic Series Atomic Layer Deposition Systems
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Houyi® Series Plate ALD System
iSparol Series Roll-to-Roll ALD System
iTomic® MW Lite Bulk Light Series Atomic Layer Deposition System
Advanced Packaging
iTronix® Series Chemical Vapor Deposition Systems
The iTronix® series of Chemical Vapor Deposition (CVD) systems, with self-developed reaction chambers and integrated electrical and software services, have a wide range of applications in the logic, storage, advanced packaging, display devices and other chip manufacturing fields, and can be used to meet the development and application needs of a variety of functional thin-film deposition processes. With the new platform, more reaction chambers can be installed to meet the demand for high capacity
Sales Email
Product Features
High-precision pressure regulation control technology for improved film step coverage
1
The composition and structure of the film can be controlled to meet the needs of the multidoping process
2
Self-developed high-precision process edge control technology to reduce wafer deburring and improve wafer utilization
3
Multi-zone heated ceramic disk with ESC enables high temperature processes, reduces backside deposition and avoids plasma damage
4
Self-designed multi-area blowing function reduces particle contamination and extends the cleaning cycle
5
Multi-zone temperature control design, high precision temperature control, good film uniformity
6
Reception Hotline：
0510-81975900
Company Addresses：
江苏省无锡市新吴区长江南路27号
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