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iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Advanced Packaging
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
MEMS
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
silicon-based microdisplay
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
semiconductor industry
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
other
Trancendor® Wafer Vacuum Transfer System
photovoltaic
boron diffusion
Hsihe® Series High Temperature Low Pressure Systems
annealing
Hsihe® Series High Temperature Low Pressure Systems
Tunneling oxidation/polysilicon deposition
Zhu Rong Series ZR5000×2 Tubular PECVD ToxPoly All-in-one System
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
Positive film Al₂O₃/SiNₓ
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
positive film Al₂O₃
Quaife® Series KF20000 Batch ALD System
backing film SiNₓ
Zhu Rong Series ZR5000×1 Tubular PECVD System
barrier package
electron transport layer SnOₓ
Interface layer/encapsulation layer AIOₓ
Industrialization Application Center
Industrialization Application Center
iOptomic Series Atomic Layer Deposition Systems
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Houyi® Series Plate ALD System
iSparol Series Roll-to-Roll ALD System
iTomic® MW Lite Bulk Light Series Atomic Layer Deposition System
IC
iTomic® HiK Series Atomic Layer Deposition Systems
iTomic® HiK series atomic layer deposition systems are suitable for customers to process high dielectric constant (High- 𝘬) gate oxygen layer, MIM capacitor insulating layer, TSV dielectric layer and other thin film process needs; ALD series of equipment by virtue of the atomic level of precise control, high coverage of the deposited film and ultra-thin film thickness uniformity can be logic chips, memory chips to provide the dielectric layer and other key process solutions. ALD series equipment can provide key process solutions for logic chips and memory chips by virtue of precise control at atomic level, high coverage of deposited film and uniformity of ultra-thin film thickness.
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Product Features
12-inch monolithic thermal ALD mass production equipment (8-inch compatible)
1
The original design of the reaction chamber and source delivery heating system can meet excellent film uniformity and repeatability, and is more suitable for film growth of three-dimensional and high aspect ratio device structures
2
Thin film materials: Al₂O₃, HfO₂, HfSiO, SiO₂, metallization and other processes
3
Four independent high temperature precursor delivery systems are configured to meet the diversified doping process needs of ALD films
4
Reception Hotline：
0510-81975900
Company Addresses：
江苏省无锡市新吴区长江南路27号
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