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iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Advanced Packaging
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
MEMS
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
silicon-based microdisplay
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
semiconductor industry
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
other
Trancendor® Wafer Vacuum Transfer System
photovoltaic
boron diffusion
Hsihe® Series High Temperature Low Pressure Systems
annealing
Hsihe® Series High Temperature Low Pressure Systems
Tunneling oxidation/polysilicon deposition
Zhu Rong Series ZR5000×2 Tubular PECVD ToxPoly All-in-one System
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
Positive film Al₂O₃/SiNₓ
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
positive film Al₂O₃
Quaife® Series KF20000 Batch ALD System
backing film SiNₓ
Zhu Rong Series ZR5000×1 Tubular PECVD System
barrier package
electron transport layer SnOₓ
Interface layer/encapsulation layer AIOₓ
Industrialization Application Center
Industrialization Application Center
iOptomic Series Atomic Layer Deposition Systems
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Houyi® Series Plate ALD System
iSparol Series Roll-to-Roll ALD System
iTomic® MW Lite Bulk Light Series Atomic Layer Deposition System
Advanced Packaging
iTomic® MW Series Batch Atomic Layer Deposition System
The iTomic® MW series batch atomic layer deposition system adopts an innovative mini-batch chamber design, which can process 25 pieces of 12-inch wafers at a time, and is suitable for critical processes and applications with low film deposition rate, high thickness requirements, and high production capacity. iTomic® MW series products utilize a unique flow field design, which provides the advantages of fast film deposition speed, small footprint, high production capacity, and low cost of use. The iTomic® MW series utilizes a unique flow field design with fast coating speed, small footprint, high throughput, and low cost of ownership to provide customized mass production solutions for memory chips, as well as Micro-OLED displays, MEMS, and more.
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Product Features
25 12“ wafer (8” wafer compatible) MW ALD system for thick film or lower growth rate process requirements
1
Provides excellent intra-wafer (WiW) and wafer-to-wafer (WtW) uniformity to better meet customer process needs
2
Thin film materials: Al₂O₃, HfO₂, SiO₂, etc
3
Compared to stovepipe type devices, the MW ALD series greatly reduces the thermal process while reducing the granularity, avoiding thermal damage to the chip devices in the process
4
It is especially suitable for mass-production coating processes for high-capacity, ultra-high aspect ratio structured devices
5
Reception Hotline：
0510-81975900
Company Addresses：
江苏省无锡市新吴区长江南路27号
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