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iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Advanced Packaging
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
MEMS
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
silicon-based microdisplay
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
semiconductor industry
iTomic® HiK Series Atomic Layer Deposition Systems
iTronix® Series Chemical Vapor Deposition Systems
iTomic® MW Series Batch Atomic Layer Deposition System
iTomic® Lite Series Lightweight Atomic Layer Deposition System
other
Trancendor® Wafer Vacuum Transfer System
photovoltaic
boron diffusion
Hsihe® Series High Temperature Low Pressure Systems
annealing
Hsihe® Series High Temperature Low Pressure Systems
Tunneling oxidation/polysilicon deposition
Zhu Rong Series ZR5000×2 Tubular PECVD ToxPoly All-in-one System
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
Positive film Al₂O₃/SiNₓ
Zhu Rong Series ZR5000×2 Tubular PEALD/PECVD Integrated System
Zhu Rong Series ZR5000×3 Tubular PEALD/PECVD Integrated System
positive film Al₂O₃
Quaife® Series KF20000 Batch ALD System
backing film SiNₓ
Zhu Rong Series ZR5000×1 Tubular PECVD System
barrier package
electron transport layer SnOₓ
Interface layer/encapsulation layer AIOₓ
Industrialization Application Center
Industrialization Application Center
iOptomic Series Atomic Layer Deposition Systems
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
Houyi® Series Plate ALD System
iSparol Series Roll-to-Roll ALD System
iTomic® MW Lite Bulk Light Series Atomic Layer Deposition System
Advanced Packaging
iTomic® PE Series Plasma Enhanced Atomic Layer Deposition Systems
iTomic® PE series plasma-enhanced atomic layer deposition (PEALD) systems can be used to prepare silicon oxide, silicon nitride, silicon nitride oxide and other thin film preparation processes and applications according to different temperature requirements. iTomic® PE series equipment can achieve the challenging process requirements such as uniformity of material thickness, film stress, thermal process, and step coverage by precisely and rapidly controlling the film-forming speed, low-temperature reaction temperature, and material proportioning technology. iTomic® PE series equipments can provide customized mask layer, dielectric layer, patterning and other key process solutions for logic chips, memory chips, advanced packages and so on.
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Product Features
Adopting the unique Thunder Balance® technology, it realizes millisecond switching of RF effect, featuring good process stability and short cycle time
1
Multi-zone heating system ensures the uniformity and stability of the reaction temperature, greatly improving the uniformity of the film
2
Thin film materials: SiO₂, low temperature SiO₂, SiN, etc
3
Adopting unique Hydro Thermal technology to realize smooth and controllable low-temperature process and meet the application of low-temperature deposition process
4
The unique Hydro Thermal technology realizes a smooth and controllable low-temperature process and meets the application of low-temperature deposition process
5
Reception Hotline：
0510-81975900
Company Addresses：
江苏省无锡市新吴区长江南路27号
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